Description
SIM Card Connector,PUSH PUSH,8P+1P,H1.85mm,without Post
Material:
Housing:High Temperature
Thermoplastic,UL94V-0.Black.
Contact:Copper Alloy.
Cover:Contact:Copper Alloys Or Steel.
Plating:
Underplate:Nickel.
Contact Area:Gold Over Nickel.
Solder Area:Tin Over Nickel.
Shell:G/F Plate Over Nickel On Solder Tails
Electrical:
Current Rating:0.5A.
Voltage Rating:5.0 Vrms.
Insulation Resistance:500M Min.At DC 500V DC
Withstanding Voltage:250V ACrms For 1 Minute.
Contact Resistance:100M Max.At 10MA/20mV MAX.
Operating Temperature: -45ºC~+85ºC
Mating Cycles:5000 Insertions.
