Email sales@bec.co.uk or call +44 (0) 1844 275824 for pricing and more information
encapsulation mode:compression moulding forming
packaging materials:Epoxy mixed SiO2
core:PMF;MF;MOF;Glaze Resistor;Wirewound Resistor;Alloy Chip Power Range:0.5-10W
Resistance range:R008-1G
Resistance tolerance:0.1%-20%
Resistance temperature coefficient:50-350PPM
Specialty:Good stability and reliability; Good insulation and moisture resistant.
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